Samsung's upcoming Galaxy Z Fold7, expected to be unveiled alongside the Galaxy Z Flip7 and Flip7 FE in New York in early or mid-July, has now been certified by the FCC. Interestingly, this reveals the chipset it will be using in most markets. The SM-F966B model that was certified is the one intended for international markets (the "B" suffix tells us that in Samsung's nomenclature), and it is powered by Qualcomm's Snapdragon 8 Elite chipset. So, it's more than likely that this chip will be inside the Fold7 across the world, just like all recent rumors have claimed. It will of course...
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